TSMC held a meeting of the Board of Directors on August 8, 2023, and passed the following resolutions:

1. Approved the distribution of a cash dividend of NT$3.00 per share for the second quarter of 2023. The record date for common stock shareholders entitled to participate in this dividend is set as December 20, 2023, and the ex-dividend date for the common shares is December 14, 2023. The dividend will be paid on January 11, 2024. Additionally, the ex-dividend date for TSMC American Depositary Shares (ADSs) is December 14, 2023, and the record date for TSMC ADSs entitled to participate in this dividend distribution is December 15, 2023.

2. Approved capital appropriations of approximately US$6,059.5 million for purposes including fab construction, installation of fab facility systems, and installation of advanced packaging, mature, and specialty technology capacity.

3. Approved an equity investment of not more than €3,499.93 million (approximately US$3,884.9 million) in a TSMC-majority-owned subsidiary, European Semiconductor Manufacturing Company (ESMC) GmbH, in Germany to provide foundry services.

4. Approved a capital injection of not more than US$4.5 billion to TSMC Arizona, a wholly-owned subsidiary of TSMC.

TSMC is a pioneering semiconductor foundry company that was founded in 1987. With global operations and the support of leading process technologies, the company serves customers worldwide and contributes to the innovation of the semiconductor industry. In 2022, TSMC deployed 288 distinct process technologies and manufactured 12,698 products for 532 customers. The company is headquartered in Hsinchu, Taiwan.

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