Williams’ visit included a meeting with TSMC President Wei Zhejia, focusing on custom artificial intelligence (AI) chips and ensuring Apple’s access to TSMC’s advanced 2nm manufacturing process.
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The iPhone 15 Pro, powered by the A17 Pro chip using TSMC’s 3nm process, showcases the benefits of denser transistor packing for better performance and efficiency. Apple’s new M4 chip in the iPad Pro also leverages this enhanced 3nm technology.
Transitioning to 2nm chips is expected to bring 10-15% performance gains and up to 30% lower power consumption.
Securing an early supply of 2nm chips is crucial for Apple as TSMC is the sole manufacturer capable of producing these chips at the required scale and quality.
This exclusivity helps Apple meet high product demand and limits competitors’ access to cutting-edge technology.
Apple’s strategy with 3nm chips involved booking all of TSMC’s available capacity, and the 2nm chips are anticipated to debut in the 2025 iPhone 17 lineup.
The post Apple COO Jeff Williams Visits Taiwan to Secure Next-Gen 2nm Chips appeared first on AppleMagazine.
