The Google Pixel 8 series is all set to launch on October 4, and so far, we have got a ton of leaks of both phones. We have seen the hands-on videos, unboxings, camera samples, and whatnot. Last month, we discussed the full spec sheet of both devices and today, a new leak has revealed the specifications of the Google Tensor G3 chip. The Tensor chip is one of the highlights of the Google Pixel phones since this chip enables Pixel phones to perform impressive machine learning and AI-related tasks.

The specifications of the Tensor G3 were shared by @ThisIsTechToday on Twitter/X.

The images above reveal that Google Tensor G3 features a one-of-a-kind 9-core CPU. The CPU features one Cortex-X3 core clocked at up to 2.91GHz, four Cortex-A715 cores at up to 2.37GHz, and four Cortex-A510 cores at up to 1.70GHz.

For comparison, the Google Tensor G2 chip had an 8-core CPU with two Cortex-X1 cores clocked at up to 2.85GHz, two Cortex-A78 cores clocked at up to 2.3GHz and four Cortex-A55 cores clocked at 1.80GHz. So, compared to last year’s chip, the Tensor G3 should significantly improve performance. Moreover, while the previous Tensor chipsets have been quite inferior to the Qualcomm or MediaTek chipsets, the Google Tensor G3 should give tough competition to them this time.

The GPU is the Mali-G715, an upgrade over the Mali-G710 GPU of Tensor G2. This 10-core GPU is also known as the ARM “Immortalis-G715” GPU, and it is the same GPU present in the MediaTek Dimensity 9200 & 9200+, the company’s most powerful chipsets of 2023.

Finally, regarding the manufacturing process, the Google Tensor G3 is based on Samsung’s 4nm process, and as per reports, this is the first chip to use the FO-WLP or Fan-out wafer-level packaging. This should theoretically mean that the Tensor G3 runs cooler than the Tensor G2, even with all the CPU and GPU upgrades.

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