This chip is built on the 2nd generation TSMC 4nm process (N4P). This means not only better performance but also better power efficiency.

The CPU has a 1 + 3 + 4 core arrangement. There is one prime Cortex-X3 core clocked at up to 3.05GHz, three Cortex-A715 cores at up to 2.85GHz, and four Cortex-A510 cores clocked at up to 1.8GHz. Speaking of the numbers, Mediatek claims a 25% reduction in CPU power consumption and a 10% better Geekbench multi-core score compared to Dimensity 9000.

It is worth mentioning that the Cortex-X3 has a lower clock speed than the Cortex-X2 in the Dimensity 9000+ (3.2GHz). The clock speed is the same as the Dimensity 9000, which suggests the plus version of Dimensity 9200 may launch with a Cortex-X3 core having a higher clock speed.

The next significant upgrade comes in the GPU. Mediatek Dimensity 9200 features the new ARM Immortalis-G715 GPU, which brings hardware-based ray tracing. MediaTek says there is up to a 41% reduction in GPU power consumption and 32% better performance than Dimensity 9000, as measured via the Manhattan 3.0 test.

Last but not least, there is the new APU or AI Processing Unit, named APU 690. According to MediaTek, there is up to a 35% performance boost over the predecessor.

MediaTek Dimensity 9200 supports LPDDR5X RAM and UFS 4.0 storage. There is Wi-Fi 7 support, and this makes it the first Wi-Fi 7-ready smartphone SOC. There is MediaTek Wi-Fi Ultrasave technology that promises up to 70% power savings. Other features include Bluetooth 5.3, sub-6GHz + mmWave, 4CC-CA sub-6GHz 5G R16 modem, MediaTek Intelligent Display Sync 3.0, Motion Blur Reduction, Frame Rate Smoother 2.0, etc.

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