Kyocera International, Inc. today announced an expansion of its U.S. semiconductor and microelectronic device assembly capabilities at its manufacturing operations in San Diego, Calif., where the company has produced high-performance semiconductor packaging products for more than 50 years. In response to U.S. semiconductor industry demand for domestic complex assembly capabilities that support rapidly advancing technologies, …

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Der Beitrag Kyocera Expands U.S.-Based Semiconductor Assembly Capabilities, Capacity, and Technology Investment erschien zuerst auf Electronics Update.