Henkel and Chip Integration Technology Center (CITC) announced today that the organizations have formalized an agreement to collaborate on the development of high-thermal die Attach Solutions for radio frequency (RF) and power electronics. Under the terms of the partnership, Henkel will supply commercialized and developmental pressureless sintering die attach formulations and CITC will provide testing …
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Der Beitrag Henkel and Citc Forge Partnership to Accelerate High-Thermal Die Attach Solutions erschien zuerst auf Electronics Update.
