Exactitude Consultancy Press Release: Global molded interconnect device market  

The global molded interconnect device market is expected to reach above USD 3.63 billion.

The global Molded Interconnect device market size is expected to grow at more than 10.34% CAGR from 2021 to 2029. Molded interconnect devices (MIDs) refer to the thermoplastic parts that are injection-molded and come integrated with electrical circuits. These 3D electromechanical components are manufactured by molding circuits into high-temperature thermoplastics and structured metallization, offering the electronics industry a novel approach to carrier circuit design. MIDs are utilized in the consumer electronics industry to substitute the stub on the internal antenna of mobile phones. Employing an internal antenna as part of the phone’s interior fittings ensures efficient utilization of space, thus minimizing volume.

The molded interconnect device market is being propelled by the increasing need for miniaturization in electronic devices.

The demand for miniaturization in electronic devices is one of the primary drivers of the molded interconnect device market. This has led to an increase in the use of MIDs due to their ability to integrate electrical circuitry into 3D plastic components, resulting in smaller and more lightweight electronic devices that are convenient and portable to use. The automotive industry has rapidly adopted MIDs due to their potential to manufacture a wide range of electronic components, including sensors and control units. MIDs can enhance the performance and reliability of these components while reducing their size and cost. The growing demand for consumer electronics like smartphones, tablets, and wearables is also expected to boost the demand for MIDs, as they can help in the development of smaller and more compact electronic devices.

Explore 188 market data Tables spread through nearly 125 Pages and in-depth analysis on “Global Molded Interconnect Device (MID) Market by Product Type (Antenna and Connectivity Modules, Connectors and Switches, Sensors, Lighting), by Process (Laser Direct Structuring (LDS), Two-Shot Molding), by Industry (Automotive, Consumer Products, Healthcare, Industrial, Military and Aerospace, Telecommunication) and by Region, Global trends and forecast with 2022 to 2029.” for Table of Contents

High capital investments with limited design flexibility may hinder the market in forecasted period.

Setting up a molded interconnect device manufacturing facility requires a significant amount of capital investment. This can make it challenging for new players to enter the market. The design of molded interconnect devices is limited by the available thermoplastic materials and the capabilities of the manufacturing process. This can make it difficult to meet the unique requirements of some applications. There is no standardization in the design and manufacturing of molded interconnect devices. This can lead to compatibility issues between different components and systems, which can increase costs and reduce efficiency. The manufacturing process for molded interconnect devices is complex and requires specialized expertise. This can make it difficult to scale up production to meet growing demand.

The COVID-19 had significant impact on the global molded interconnect device market.

The pandemic has had several effects on the supply chain, including delays in the delivery of raw materials, components, and finished goods. This has caused disruptions, production delays, longer lead times, and higher expenses. The pandemic has also decreased the need for MID goods in various sectors such as aerospace and automotive industries, due to the slowdown in manufacturing and sales. However, there is now a higher demand for medical equipment, including ventilators, due to the epidemic. MID technology can be used to create compact and lightweight medical gadgets that can be particularly helpful in the fight against COVID-19. Additionally, the pandemic has increased interest in eco-friendly and sustainable products. The implementation of digital technologies, such as telemedicine and remote monitoring, has been accelerated due to the pandemic, which is expected to drive the MID market’s long-term growth. MID technology can be used to create compact and integrated devices for use in digital health applications. In a post-pandemic environment, MID technology can enable the creation of products with lower material and energy use, which can be attractive to consumers.

Global Molded Interconnect Device (MID) Market Players

Key competitors from both domestic and international markets compete fiercely in the worldwide global molded interconnect device (MID) industry include Molex, TE Connectivity, Amphenol Corporation, LPKF Laser & Electronics, Taoglas, Harting, GALTRONICS, Cicor Group, S2P Smart Plastic Product, Johnan.

Key Market Segments: Global Molded Interconnect Device (MID) Market

Global Molded Interconnect Device (Mid) Market By Product Type, 2020-2029, (USD Billion), (Thousand Units)

• Antenna And Connectivity Modules
• Connectors And Switches
• Sensors
• Lighting

Global Molded Interconnect Device (Mid) Market By Process, 2020-2029, (USD Billion), (Thousand Units)

• Laser Direct Structuring (LDS)
• Two-Shot Molding

Global Molded Interconnect Device (Mid) Market By Industry, 2020-2029, (USD Billion), (Thousand Units)

• Automotive
• Consumer Products
• Healthcare
• Industrial
• Military And Aerospace
• Telecommunication And Computing

Global Molded Interconnect Device (Mid) Market By Region, 2020-2029, (USD Billion), (Thousand Units)

• North America
• Europe
• Asia Pacific
• South America
• Middle East And Africa

                IMPORTANT COUNTRIES IN ALL REGIONS ARE COVERED

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