Taiwan Semiconductor Manufacturing Company (TSMC) is set to invest $2.9 billion in an Advanced Chip Packaging plant in Taiwan as demand for AI chips grows. TSMC is the world's top producer of advanced processors found in devices like iPhones and Macs. The investment is driven by the rapid growth of the AI market, which has caused a surge in demand for TSMC's advanced packaging. The facility will be located in Tongluo Science Park and is expected to create 1,500 local jobs. TSMC's CEO, C. C. Wei, stated that they are experiencing tight capacity but are increasing it to support customers.

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