Welcome to the 30th of May 2023: Our goal is to celebrate the pioneering inventors recognitions who have reached noteworthy milestones in their fields this week.
Xiaoyi Wang
Dr. Wang is a Senior Comm Systems Engineer at Amazon. He has also served in key researcher, engineering and architect roles at companies such as IBM and Nokia Siemens Networks.
He has served as a physical layer chief architect, responsible for all physical layer new concepts (development and standardization) including CoMP, ePDCCH, NCT, etc.
Dr. Wang attended the Beijing University of Posts and Telecommunications where he received his M.S. and Ph.D. in Wireless Communications in 2004 and 2010, respectively.
Patent №: 11664877 (May 30, 2023) – This technology corrects interference using hybrid beamforming. It analyzes RF saturation data for different directions, finds a saturation-free direction, and receives an RF signal from another device in that direction at a specific time.
Patent №: 11665686 (May 30, 2023) – This technology enables time-division multiplexing for a dual-subscriber identity module (SIM) using a single radio in advanced networks like 5G, 6G, and beyond. This allows the mobile device, which may have two SIM cards, to operate efficiently.
Bin Wang
Vice President of Huawei Cloud China.
Patent №: 11663468 (May 30, 2023) – This method trains a neural network by training a super network with multiple candidate sub-structures in each layer. Then, specific sub-structures are selected to form a sub-network. The sub-network is trained using the network parameter inherited from the super network, resulting in its own network parameter.
Gholam A. Peyman
Professor of Basic Medical Sciences at the University of Arizona.
He is an ophthalmologist, retina surgeon, and inventor. He is best known for his invention of LASIK eye surgery, a vision correction procedure designed to allow people to see clearly without glasses. He was awarded the first US Patent for the procedure in 1989.
Peyman was born in Shiraz, Iran. At the age of 19, he moved to Germany to begin his medical studies. He received his MD at the University of Freiburg in 1962.
Dr. Peyman’s Patents cover a broad range of novel medical devices, intra-ocular drug delivery, surgical techniques, as well as new methods of diagnosis and treatment.
Dr. Peyman received the National Medal of Technology and Innovation (2012), the Waring Medal of the Journal of Refractive Surgery (2008), and the American Academy of Ophthalmology‘s Lifetime Achievement Award (2008). He was named a fellow of the National Academy of Inventors in 2013.
Patent №: 11660229 (May 30, 2023) – Cancer treatment methods by administering thermotherapy or thermotherapy and immunotherapy, and optionally gene delivery. Prevents tumour recurrence by enhancing the patient’s immune response during initial and subsequent treatments. May involve vaccines.
Chien-Hsun Lee
Enable Digital Transformation at TSMC.
Seasoned executive and technologist with a demonstrated history of working in the tech industry. Skilled in business strategy, product definition, engineering execution, and product launch. Worked on semiconductor manufacture, networking SoC chip design, high-speed interface, and high-performance server memory products.
Strong operations professional graduated from UC Berkeley, Haas School of Business, and Stanford School of Engineering.
Patent №: 11664566 (May 30, 2023) – This semiconductor device consists of a first and second transmission line. Between these lines, there is a high-k dielectric material that partially covers them. Additionally, there is a dielectric material, which has a different dielectric constant than the high-k dielectric material and directly touches both the first and second transmission lines.
Patent №: 11665834 (May 30, 2023) – This electronic assembly includes a carrier substrate with a flexible structure and circuit structure, along with an electronic device.
Yu-Hsiang Hu
Engineer at TSMC.
He is a respected figure in the field of packaging technology, with a specific focus on improving the structure and manufacturing processes of semiconductor packages.
Patent №: 11664323 (May 30, 2023) – This device has an integrated circuit die enclosed in a moulding compound, with a through via adjacent to the die. It also features a redistribution structure, which is electrically connected to the integrated circuit die and the through via. Notably, the interface between the conductive vias is non-planar.
Xiaohui Shen
Research Manager at ByteDance/TikTok.
Xiaohui Shen received B.S. and M.S. degrees from the Department of Automation, Tsinghua University, China, and a Ph.D. degree from the Department of EECS, Northwestern University. He was a Senior Research Scientist with Adobe Research.
He is currently a Researcher with the Bytedance AI Laboratory. His research interests include computer vision and deep learning
Patent №: 11663762 (May 30, 2023) – This invention preserves important image regions by calculating scores for the preservation and positioning of regions of interest in candidate image crops. These scores are used to select recommended image crops for further analysis.
Qiang Wang
Lead Developer at Microsoft.
Patent №: 11663728 (May 30, 2023) – This invention estimates depth using an image sensor that captures upper pixels with N sub-pixels. Sub-images are extracted for each sub-pixel, and a neural network determines the viewpoint difference. Another neural network generates a depth map based on this difference.
This post first appeared on IDiyas Blog On Prolific Inventors And Their Inventions And Patents, please read the originial post: here
