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Inkjet printing technology for increasing the I/O density of 3D TSV interposers

By Behnam Khorramdel

Inkjet Printing Technology for increasing the I/O density of 3D TSV interposers

Microsystems & Nanoengineering, Published online: 10 April 2017; doi:10.1038/micronano.2017.2

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Source:: http://feeds.nature.com/~r/micronano/rss/current/~3/b8KvQwmL5j4/micronano20172

      



This post first appeared on Measurement Databases For Industry & Science, please read the originial post: here

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Inkjet printing technology for increasing the I/O density of 3D TSV interposers

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