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Qualcomm Snapdragon 845 SoC launched details will be revealed on Dec 7.

Qualcomm much-awaited flagship Chip SD845 finally launched at Qualcomm Technology Summit at Maui yesterday.After series of leaks and rumors finally, Qualcomm officially announces the upcoming SD845 chip for 2018 flagship devices.


Earlier we had rumors about Samsung booking the first lot of Qualcomm SD845 chip for its US variant of Samsung Galaxy S9 and S9+.Even Xiaomi CEO Lei Jun confirmed that Xiaomi Mi 7 will be powered by SD845 chip and will be the first company to launch the device with SD845 chip in China.However, Samsung Galaxy S9 and S9+ will be the first device to be powered by new SD845 chip and is rumored to be launched in MWC held in Berlin.




As per earlier rumors, the SD845 chip will be built on the same 10nm FinFET (LPE) process as SD835 chip.There is a major upgrade in terms of GPU from Adreno 540 to new Adreno 630 GPU on SD845 chip and will come with latest Qualcomm X20 LTE modem with Gigabit LTE connectivity with downloads speeds up to 1.2 Gbps.The new SD845 chip has support for Dual cameras up to 25MP on both front and back of the device.


We have to wait for Qualcomm to officially unveil the specs of the SD845 chip tomorrow.


This post first appeared on Tech News India, please read the originial post: here

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Qualcomm Snapdragon 845 SoC launched details will be revealed on Dec 7.

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