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Lanner to Demonstrate Edge Consolidation for Future Manufacturing at Taipei Int’l Industrial Automation Exhibition

To deliver the required real-time, secured and cutting-edge technology as the next-generation manufacturing revolution, Lanner provides highly integrated edge server platform with Intel multi-core processor that fully optimize performance and minimize latencies, while consolidating all the needed network functions.

Come visit our booth at # 1528 at Taipei Int’l Industrial Automation Exhibition, which takes place on Aug 1 to 4 in Taipei Nangang Exhibition Center 1F.

Featured Products

LEC-2580


High-performance IPC with IntelR 6th Gen Skylake Core? i7/i5/i3 CPU

CPU IntelR Core? i7-6600U/i5-6300U/i3- 6100U
Chipset AMI 128Mbit SPI Flash BIOS

Read more

LEC-2137


Optimized IoT-ready Solution for Machine Vision and Physical Security

CPU IntelR Atom? x7-E3950 or IntelR CeleronR N3350
Chipset AMI 64Mbit SPI Flash BIOS

Read more

LEC-7230


Small Form Factor Digital Signage PC with Intel® Bay Trail CPU

CPU 2C or 4C Bay Trail SoC
Chipset AMI SPI Flash BIOS

Read more

The post Lanner to Demonstrate Edge Consolidation for Future Manufacturing at Taipei Int’l Industrial Automation Exhibition appeared first on Lanner.



This post first appeared on Software-Defined Networks, IoT And Next-Generation Infrastructure, please read the originial post: here

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Lanner to Demonstrate Edge Consolidation for Future Manufacturing at Taipei Int’l Industrial Automation Exhibition

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